Semiconductor device having an interposer
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United States of America Patent
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May 22, 2012
Grant Date -
Feb 10, 2011
app pub date -
Aug 4, 2009
filing date -
Aug 4, 2009
priority date (Note) -
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Abstract
A semiconductor device and a method of fabricating the same. An interposer used for the semiconductor device includes integrated circuits therein to realize the functions of a decoupling capacitor, an ESD preventing circuit, an impedance matching circuit, and termination. The semiconductor device may include a semiconductor die with a through silicon via (TSV) structure having two or more through electrodes that pass through the semiconductor die, in which each of the through electrodes are connected to a respective bond pad of the semiconductor die.
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