No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
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United States of America Patent
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May 22, 2012
Grant Date -
Nov 22, 2007
app pub date -
Jul 5, 2006
filing date -
May 16, 2006
priority date (Note) -
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Abstract
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages are described. A die-up or die-down package includes an IC die, a die attach pad, a heat spreader cap coupled to the die attach pad defining a cavity, and one or more peripheral rows of leads surrounding the die attach pad. The leads do not protrude substantially from the footprint of the encasing structure. The die attach pad and the heat spreader cap defines an encasing structure that substantially encloses the IC die, and shields EMI emanating from and radiating towards the IC die. The encasing structure also dissipates heat generated by the IC die during operation.
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