Importance

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Abstract

An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1):

description='In-line Formulae' end='lead'CH₂═CR₀—COO—R₁—NHCOO—R₂  (1)description='In-line Formulae' end='tail'

wherein R₀ is a hydrogen atom or a methyl group, R₁ is a divalent hydrocarbon group, and R₂ is an optionally substituted lower alkyl group.

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First Claim