Insulating layer for rigid printed circuit boards

United States of America Patent

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May 29, 2012
Grant Date
Jun 18, 2009
app pub date
Dec 5, 2008
filing date
Dec 7, 2007

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Abstract

One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.

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Patent Owner	Address
INTEGRAL TECHNOLOGY INC	20322 WINDROW DRIVE LAKE FOREST CA 92630

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H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

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[Patents Count]

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Inventor Name	Address	# of filed Patents	Total Citations
Hunrath, Christopher A	San Juan Capistrano, US	6	58

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Insulating layer for rigid printed circuit boards

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United States of America Patent

12329488

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PATENT NO	8188373
APP PUB NO	20090151989A1
SERIAL NO	12329488
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 29, 2012	US,8188373,B2 US8188373B2	GRANTED PATENT AS SECOND PUBLICATION
June 18, 2009	US,20090151989,A1 US20090151989A1	FIRST PUBLISHED PATENT APPLICATION

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12329488

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