Integration of vacuum microelectronic device with integrated circuit
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United States of America Patent
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May 29, 2012
Grant Date -
Nov 8, 2007
app pub date -
May 5, 2006
filing date -
May 5, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device includes an integrated circuit (IC) and at least one ultra-small resonant structure formed on said IC. At least the ultra-small resonant structure portion of the device is vacuum packaged. The ultra-small resonant structure portion of the device may be grounded or connected to a known electrical potential. The ultra-small resonant structure may be electrically connected to the underlying IC, or not.
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