Lithographic apparatus and method

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United States of America Patent

PATENT NO 8189172
APP PUB NO 20080309899A1
SERIAL NO

11763275

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Abstract

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Systems and methods are provided for measuring aberration in a lithographic apparatus. A radiation beam is modulated using an array of individually controllable elements, and the modulated beam is projected using a projection system. A pattern is provided on the array of individually controllable elements to modulate the radiation beam, and the pattern comprises a repeating structure that is formed from a plurality of features that are dimensioned such that first order diffraction of the radiation beam substantially fills the pupil of the projection system. A sensor detects the projected radiation and measures interference in the radiation projected by the projection system. Aberration in the detected radiation beam is then measured.

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Patent Owner(s)

  • ASML NETHERLANDS B.V.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baselmans, Johannes Jacobus Matheus Oirschot, NL 160 4008
Bleeker, Arno Jan Westerhoven, NL 99 2903

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