Lithography method

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United States of America Patent

PATENT NO 8192920
APP PUB NO 20090269705A1
SERIAL NO

12386899

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Abstract

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Embodiments of the invention relate to lithography method useful for patterning at sub-micron resolution. This method comprised of deposition and patterning self-assembled monolayer resists using rolling applicator and rolling mask exposure apparatus. Typically the application of these self-assembled monolayers involves contacting substrate materials with a rotatable applicator in the shape of cylinder or cone wetted with precursor materials. The nanopatterning technique makes use of Near-Field photolithography, where the mask used to pattern the substrate is in contact with self-assembled monolayer. The Near-Field photolithography may make use of an elastomeric phase-shifting mask, or may employ surface plasmon technology, where a rotating mask surface comprises metal nano holes or nanoparticles.

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Patent Owner(s)

Patent OwnerAddress
METAMATERIAL TECHNOLOGIES USA INC5880 WEST LAS POSITAS BOULIVARD SUITE 51 PLEASANTON CA 94588

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobrin, Boris Dublin, US 77 1968

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