Wafer-level, polymer-based encapsulation for microstructure devices
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United States of America Patent
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Jun 5, 2012
Grant Date -
Dec 9, 2010
app pub date -
Aug 17, 2010
filing date -
May 25, 2005
priority date (Note) -
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Abstract
A device includes a first device structure having a semiconductor platform, and a second device structure having a microstructure spaced from the semiconductor platform. The device further includes a cable having a plurality of beams to couple the microstructure to the first device structure. Each beam of the plurality of beams has a polymer coating and a serpentine-shaped region.
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