Wafer-level, polymer-based encapsulation for microstructure devices

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United States of America Patent

PATENT NO 8193645
APP PUB NO 20100308456A1
SERIAL NO

12858192

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Abstract

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A device includes a first device structure having a semiconductor platform, and a second device structure having a microstructure spaced from the semiconductor platform. The device further includes a cable having a plurality of beams to couple the microstructure to the first device structure. Each beam of the plurality of beams has a polymer coating and a serpentine-shaped region.

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Patent Owner(s)

  • THE REGENTS OF THE UNIVERSITY OF MICHIGAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gulari, Mayurachat Ning Ann Arbor, US 14 251
Wise, Kensall D Ann Arbor, US 39 3217
Yao, Ying Ann Arbor, US 14 59

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