Method for taking an electronic component out of a carrier tape
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United States of America Patent
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Jun 12, 2012
Grant Date -
Jun 3, 2010
app pub date -
Dec 10, 2009
filing date -
Jun 13, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall.
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