Light source unit and lighting system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8197097
APP PUB NO 20090290346A1
SERIAL NO

12467395

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The light source unit is provided with a substrate and a decorative cover having thermal conductivity. The substrate includes a circuit pattern area, in which a plurality of LED chips are disposed, at the middle part thereof, has thermal conductivity, and transmits heat from the circuit pattern area to an area in the outer circumferential direction thereof. The decorative cover encloses the substrate, is electrically insulated from the circuit pattern area, and is thermally coupled to the surface side of the substrate at the periphery of the circuit pattern area by being face-contacted thereto. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TOSHIBA LIGHTING & TECHNOLOGY CORPORATIONTOKYO455

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Betsuda, Nobuhiko Yokohama, JP 38 159
Nishimura, Kiyoshi Yokosuka, JP 88 629
Ogawa, Kozo Yokosuka, JP 37 312
Saito, Akiko Yokohama, JP 118 1341
Tamai, Hiroki Yokosuka, JP 30 115

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 2010/0061,089 FLEXIBLE LIGHT STRIP 5 2008
 
KONINKLIJKE PHILIPS ELECTRONICS N.V. (1)
2007/0001,177 Integrated light-emitting diode system 10 2004
 
CREE, INC. (1)
2007/0200,127 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE 22 2007
 
AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. (1)
* 2008/0074,884 Compact high-intensty LED-based light source and method for making the same 6 2006
 
HIGH POWER LIGHTING CORP. (1)
2007/0126,020 High-power LED chip packaging structure and fabrication method thereof 29 2005
 
LITE-ON TECHNOLOGY CORPORATION (1)
2007/0001,290 Semiconductor packaging structure 3 2005
 
NEOBULB TECHNOLOGIES, INC. (1)
2009/0101,932 Semiconductor light-emitting device and method of fabricating the same 3 2006
 
LG ELECTRONICS INC. (1)
* 7628525 Illumination device for refrigerator 11 2006
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
LUMENS CO., LTD. (2)
* 9142747 Light emitting device package and backlight unit comprising the same 0 2012
* 2014/0328,083 LIGHT EMITTING DEVICE PACKAGE AND BACKLIGHT UNIT COMPRISING THE SAME 2 2012
 
MOLEX INCORPORATED (1)
8690389 Illumination module 2 2012
 
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1)
9194570 Lamp and lighting apparatus 0 2011
* Cited By Examiner

Maintenance Fees

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