Laser processing of workpieces containing low-k dielectric material
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United States of America Patent
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Jun 12, 2012
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app pub date -
May 24, 2006
filing date -
May 24, 2006
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Abstract
Laser output including at least one laser pulse having a wavelength greater than 1.1 μm and shorter than 5 μm (preferably at about 1.1 μm) and having a pulsewidth shorter than 100 ps (preferably shorter than 10 ps) permits low-k dielectric material, such as SRO or SiCOH, to be removed without damaging the substrate. An oscillator module in cooperation with an amplification module are used to generate the laser output.
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