Heat sink and integrated circuit assembly using the same
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United States of America Patent
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-
Jun 12, 2012
Grant Date -
Jun 30, 2011
app pub date -
Dec 31, 2009
filing date -
Dec 31, 2009
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An integrated circuit assembly includes a heat sink and a substrate coupled to the heat sink. The heat sink includes a base and a plurality of fins disposed on the base, the base has an intermediate portion and two side portions connected to the intermediate portion, the intermediate portion has a first width and the side portions has a second width larger than the first width, and the fins are disposed on the side portions of the base. The substrate is made of ceramic material and has an upper surface with an opening and a lower surface with a groove, the groove matches the intermediate portion of the heat sink, and the opening is configured to expose a portion of the intermediate portion to receive an integrated circuit package.
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