Protective layer for bond pads
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 12, 2012
Grant Date -
May 13, 2010
app pub date -
Feb 20, 2009
filing date -
Nov 13, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A process for forming a protective layer at a surface of an aluminum bond pad. The aluminum bond pad is exposed to a solution containing silicon, ammonium persulfate and tetramethylammonium hydroxide, which results in the formation of the protective layer. This protective layer protects the bond pad surface from corrosion during processing of an imager, such as during formation of a color filter array or a micro-lens array.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully