System in package and method of creating system in package
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United States of America Patent
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Jun 12, 2012
Grant Date -
N/A
app pub date -
Aug 26, 2008
filing date -
Mar 15, 2005
priority date (Note) -
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Abstract
Some embodiments of the invention provide a system that includes a first defect tolerant configurable integrated circuit and a second IC communicatively coupled to the defect tolerant configurable first IC.
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