Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting
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United States of America Patent
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Jun 19, 2012
Grant Date -
Mar 11, 2010
app pub date -
Mar 10, 2008
filing date -
Mar 19, 2007
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Abstract
The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method.
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