Integrated circuit package in package system with adhesiveless package attach
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United States of America Patent
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Jun 19, 2012
Grant Date -
Jan 1, 2009
app pub date -
Jun 27, 2007
filing date -
Jun 27, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit package in package system includes a package in package lead with a package in package lead surface substantially planar, attaching a first integrated circuit package having a first encapsulant surface substantially coplanar with the package in package lead surface, attaching a second integrated circuit near the first integrated circuit package, and forming a package in package encapsulant over the first integrated circuit package and the second integrated circuit.
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