Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration

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United States of America Patent

PATENT NO 8203421
APP PUB NO 20090256669A1
SERIAL NO

12417589

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Abstract

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A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

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Patent Owner(s)

Patent OwnerAddress
LITTELFUSE INC8755 WEST HIGGINS ROAD SUITE 500 CHICAGO IL 60631

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fleming, Robert San Jose, US 87 1195
Graydon, Bhret San Jose, US 12 199
Kosowsky, Lex San Jose, US 69 810

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