Processing thin wafers

United States of America Patent

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Jun 26, 2012
Grant Date
Oct 8, 2009
app pub date
Jun 16, 2009
filing date
Nov 18, 2004

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Abstract

There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.

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Patent Owner	Address
INTEVAC INC	SANTA CLARA CA

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Inventor Name	Address	# of filed Patents	Total Citations
Bluck, Terry	Santa Clara County, US	86	2628
Scollay, Stuart	Santa Clara County, US	11	60
Tong, Edric	Santa Clara County, US	31	716

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Processing thin wafers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12485808

048635-002200

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PATENT NO	8206551
APP PUB NO	20090252582A1
SERIAL NO	12485808
DOCKET NO	048635-002200

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 26, 2012	US,8206551,B2 US8206551B2	GRANTED PATENT AS SECOND PUBLICATION
October 08, 2009	US,20090252582,A1 US20090252582A1	FIRST PUBLISHED PATENT APPLICATION

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12485808

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