Material for forming electroless plate and method for forming electroless plate using the same

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United States of America Patent

PATENT NO 8206828
APP PUB NO 20090075089A1
SERIAL NO

12224722

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Abstract

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A material for electroless plating shows good adhesion for a catalyst and does not cause delamination of a catalyst adhering layer from a non-conductive base material in a catalyst adhering step, development step or other step.

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Patent Owner(s)

Patent OwnerAddress
KANTO GAKUIN SCHOOL CORPORATION1-50-1 MUTSUURAHIGASHI KANAZAWA-KU YOKOHAMA-SHI KANAGAWA 236-8501

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ohta, Tetsuji Tokyo, JP 9 18
Watanabe, Mitsuhiro Yokosuka-shi, JP 117 2447

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