Power semiconductor package with bottom surface protrusions
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United States of America Patent
Stats
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Jun 26, 2012
Grant Date -
Feb 3, 2011
app pub date -
Jul 31, 2009
filing date -
Jul 31, 2009
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A package includes a body that encapsulates a semiconductor die, the body having a first pair of opposing lateral sides, a second pair of opposing lateral sides, a top, and a bottom. The bottom has a primary surface and a plurality of protrusions that extend outward from the primary surface. When the package is mounted to a printed circuit board (PCB) the protrusions contact the PCB and the primary surface is disposed a first distance away from the PCB. The package further includes a plurality of leads that extend outward from the first pair of opposing lateral sides.
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