Microelectronic package comprising offset conductive posts on compliant layer
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United States of America Patent
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Jun 26, 2012
Grant Date -
Aug 18, 2005
app pub date -
Nov 10, 2004
filing date -
Dec 30, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.
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