Low application temperature hot melt adhesive composition and articles including the same

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United States of America Patent

PATENT NO 8211521
APP PUB NO 20090120577A1
SERIAL NO

12270368

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Abstract

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A hot melt adhesive composition that includes a first tackifying agent that includes phenol-modified aromatic hydrocarbon resin, thermoplastic polymer that includes ethylene copolymer, and a first wax.

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Patent Owner(s)

Patent OwnerAddress
H B FULLER COMPANY1200 WILLOW LAKE BLVD P O BOX 64683 ST PAUL MN 55164-0683

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eichler-Johnson, Beth St. Paul, US 1 5
Rogachevsky, Vitaly Woodbury, US 4 22

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