Methods and systems for detecting defects in a reticle design pattern
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United States of America Patent
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Jul 3, 2012
Grant Date -
Jan 15, 2009
app pub date -
May 7, 2008
filing date -
May 9, 2007
priority date (Note) -
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Abstract
Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of the reticle design pattern using a sensor disposed on a substrate arranged proximate to an image plane of an exposure system configured to perform a wafer printing process using the reticle design pattern. The images illustrate how the reticle design pattern will be projected on a wafer by the exposure system at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in the reticle design pattern based on a comparison of two or more of the images corresponding to two or more of the different values.
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