Sensor device to monitor deformation in structural members, such as solid structures
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United States of America Patent
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Jul 10, 2012
Grant Date -
Jul 15, 2010
app pub date -
May 2, 2008
filing date -
May 2, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A sensor device comprises a sensing component adapted to be connected to a monitoring system to send signals associated with deformation of a structural member. An adhesive is adapted to bond the sensing component to a surface of a structural member. A tape has at least one adhesive surface adapted to be adhered to the surface of a structural member to be monitored, with the sensing component being positioned between the tape and the surface of the structural member. The sensor device is used in combination with a monitoring system.
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