Spinal implant kits with multiple interchangeable modules
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United States of America Patent
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-
Jul 10, 2012
Grant Date -
Jun 10, 2010
app pub date -
Feb 18, 2010
filing date -
Jan 27, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interspinous implant kit includes a receiver body and multiple modules. The receiver body is adapted to be implanted between a spinous processes and includes corresponding saddles with an intermediate section therebetween. The intermediate section includes a module-receiving bay. The modules are configured to be interchangeably received in the bay. The first module may have a sensor adapted to generate measurement data indicative of at least one of forces acting on said receiver body and strain when mated to said receiver body. The second and third modules have mechanical material properties that are the of the same type, but different. One of the modules is advantageously mated to the receiver body to form a long-term implant.
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