Production methods of electronic devices
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United States of America Patent
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Jul 10, 2012
Grant Date -
Mar 12, 2009
app pub date -
Oct 24, 2008
filing date -
Dec 27, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A method of producing an electronic device having mounted thereon a microelectromechanical system element. The method includes forming a micromachine component and electronic component for operation of the micromachine component on a substrate to form the system element, and bonding to the substrate a lid covering an active surface of the substrate and provided with wiring patterns to define an operating space for the micromachine component and electrically connecting the electronic component and the wiring patterns of the lid at a bonded part of the substrate and the lid.
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