Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)
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United States of America Patent
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Jul 10, 2012
Grant Date -
Feb 23, 2012
app pub date -
Oct 31, 2011
filing date -
Apr 24, 2006
priority date (Note) -
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Abstract
A semiconductor module system includes a module substrate and first and second semiconductor components stacked on the module substrate. The stacked semiconductor components include through wire interconnects that form an internal signal transmission system for the module system. Each through wire interconnect includes a via, a wire in the via and first and second contacts on the wire.
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