Eliminate release etch attack by interface modification in sacrificial layers
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United States of America Patent
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Jul 17, 2012
Grant Date -
Dec 18, 2008
app pub date -
Apr 2, 2008
filing date -
Apr 4, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Methods of making a microelectromechanical system (MEMS) device are described. In some embodiments, the method includes forming a sacrificial layer over a substrate, treating at least a portion of the sacrificial layer to form a treated sacrificial portion, forming an overlying layer over at least a part of the treated sacrificial portion, and at least partially removing the treated sacrificial portion to form a cavity situated between the substrate and the overlying layer, the overlying layer being exposed to the cavity.
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