Stackable via package and method
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United States of America Patent
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Jul 17, 2012
Issued Date -
N/A
app pub date -
Jun 12, 2009
filing date -
Jun 12, 2009
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.
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