Methods of fabricating a membrane with improved mechanical integrity
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United States of America Patent
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Jul 24, 2012
Grant Date -
May 19, 2011
app pub date -
Jan 25, 2011
filing date -
Feb 12, 2001
priority date (Note) -
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Abstract
Forming a thin film acoustic device by patterning a layer of non-conducting material on a first side of a substrate to expose a portion of the first substrate side; depositing layers of conducting material on the layer of non-conducting material and the exposed portion of the first substrate side; depositing a layer of piezoelectric material on the layers of conducting material; depositing and patterning additional layers of material on the layer of piezoelectric material to form a first device electrode; depositing and patterning a masking layer on a second side of the substrate to expose a portion of the second substrate side; etching away the exposed substrate portion to expose the patterned layer of non-conducting material and a portion of the layers of conducting material; and etching away the exposed portion of the layers of conducting material to form a second device electrode.
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