Method for manufacturing a circuit board structure, and a circuit board structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 24, 2012
Issued Date -
N/A
app pub date -
Jun 16, 2006
filing date -
Jun 16, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
This publication discloses a method for manufacturing a circuit-board structure.1. The structure comprises a conductor pattern (3) and at least one component (6), which is surrounded by an insulating-material layer (10), attached to it by means of a contact bump (5). According to the invention, the contact bumps (5) are made on the surface of the conductor pattern (3), before the component (6) is attached to the conductor pattern (3) by means of the contact bump (5). After attaching, the component (6) is surrounded with an insulating-material layer (10).
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully