Substrate support with electrostatic chuck having dual temperature zones
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United States of America Patent
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Jul 24, 2012
Grant Date -
Nov 8, 2007
app pub date -
Apr 26, 2007
filing date -
Apr 27, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electrostatic chuck for receiving a substrate in a substrate processing chamber comprises a ceramic puck having a substrate receiving surface and an opposing backside surface with a plurality of spaced apart mesas. An electrode is embedded in the ceramic puck to generate an electrostatic force to hold a substrate. Heater coils located at peripheral and central portions of the ceramic puck allow independent control of temperatures of the central and peripheral portions of the ceramic puck. The chuck is supported by a base having a groove with retained air. The chuck and base can also have an overlying edge ring and clamp ring.
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