Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating
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United States of America Patent
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Jul 24, 2012
Grant Date -
Sep 1, 2011
app pub date -
Apr 14, 2011
filing date -
Mar 19, 2004
priority date (Note) -
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Abstract
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
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