Removal of impurities from semiconductor device layers
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United States of America Patent
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Jul 24, 2012
Grant Date -
Nov 5, 2009
app pub date -
May 1, 2009
filing date -
Nov 2, 2006
priority date (Note) -
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Abstract
A method for removing impurities from at least one semiconductor device layer during manufacturing of a semiconductor device is disclosed. The semiconductor device layer has a compound semiconductor material and/or germanium. Each heating process performed during the manufacturing of the semiconductor device after provision of the semiconductor device layer has a low thermal budget determined by temperatures equal to or lower than about 900° C. and time periods equal to or lower than about 5 minutes. In one aspect, the method includes providing a germanium gettering layer with a higher solubility for the impurities than the semiconductor device layer. The germanium gettering layer is provided at least partly in direct or indirect contact with the at least one semiconductor device layer, such that impurities can diffuse from the at least one semiconductor device layer to the germanium gettering layer.
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