Semiconductor device having metal wirings of laminated structure
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United States of America Patent
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Jul 24, 2012
Grant Date -
Apr 14, 2011
app pub date -
Dec 20, 2010
filing date -
Feb 21, 2007
priority date (Note) -
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Abstract
A semiconductor device that includes a metal wiring formed on the insulating film and having a main wiring portion laminated with a plurality of metal films and a metal protection film formed at least on the upper surfaces of the main wiring portion and made of a precious metal material.
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