Integrated circuit packaging system with interposer
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United States of America Patent
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Jul 24, 2012
Grant Date -
Jun 14, 2012
app pub date -
Feb 15, 2012
filing date -
Sep 21, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit packaging system comprising: a base package substrate; a first integrated circuit die attached over the base package substrate; and an interposer having a recessed edge and a corner that extends to a singulation edge, the interposer mounted over the first integrated circuit die, the interposer having a recess gap between the recessed edge and the singulation edge.
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