MEMS microphone, production method and method for installing

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United States of America Patent

PATENT NO 8229139
APP PUB NO 20080279407A1
SERIAL NO

12092423

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A microphone in a miniaturized form is described herein. The microphone includes a flat carrier substrate having a first recess extending through the carrier substrate. The microphone includes a first electro-acoustic transducer on a first surface of the carrier substrate and at least partially overlapping the first recess. The microphone also includes a cap on a second surface opposite the first surface having a tight seal with the second surface and spanning the first recess. The cap includes at least one metallic layer for electromagnetic shielding.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATION2-5-1 NIHONBASHI CHUO-KU TOKYO 103-6128

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pahl, Wolfgang Munich, DE 66 1817

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