Electromechanical device configured to minimize stress-related deformation and methods for fabricating same
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United States of America Patent
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Jul 24, 2012
Grant Date -
Oct 21, 2010
app pub date -
Jun 28, 2010
filing date -
Aug 19, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of MEMS devices include a movable layer supported by overlying support structures, and may also include underlying support structures. In one embodiment, the residual stresses within the overlying support structures and the movable layer are substantially equal. In another embodiment, the residual stresses within the overlying support structures and the underlying support structures are substantially equal. In certain embodiments, substantially equal residual stresses are be obtained through the use of layers made from the same materials having the same thicknesses. In further embodiments, substantially equal residual stresses are obtained through the use of support structures and/or movable layers which are mirror images of one another.
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