Overmolded circuit board and method
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United States of America Patent
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Jul 31, 2012
Grant Date -
Jun 18, 2009
app pub date -
Dec 12, 2008
filing date -
Dec 12, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An electrical device includes a circuit board having one or more electrical components mounted to the circuit board. At least a portion of the circuit board is encapsulated in a thermoplastic polymer material to encapsulate the electrical components. The device may be fabricated by at least partially shielding the electrical components with polymer material, followed by overmolding the polymer material with thermoplastic polymer material. The shielding material may comprise a pre-formed component, or it may comprise thermoplastic polymer material that is molded around the electrical components in a first molding step or “shot”.
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