Probe head with machine mounting pads and method of forming same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8232816
APP PUB NO 20070182430A1
SERIAL NO

11641255

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Abstract

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A probe head for testing semiconductor wafers has a probe contactor substrate have a first side and a second side. A plurality of probe contactor tips are coupled to the first side and the plurality of tips lie in a first plane. A plurality of mounting structures are coupled to the second side with each of the mounting structures each having a top surface lying in a second plane, wherein the first plane is substantially parallel to the second plane.

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Patent Owner(s)

Patent OwnerAddress
FORMFACTOR INC7005 SOUTHFRONT ROAD LIVERMORE CA 94551

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Garabedian, Raffi Monrovia, US 31 295
Ismail, Salleh Moorpark, US 18 258
Wang, Steven Hacienda Heights, US 69 1059

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