Method for separating semiconductor wafer into chips
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United States of America Patent
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-
Aug 7, 2012
Grant Date -
Nov 3, 2011
app pub date -
Jul 19, 2010
filing date -
Apr 30, 2010
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for separating a semiconductor wafer into chips includes the steps of sandwiching a soluble spacer between a wafer and a substrate to form a laminate, etching the wafer into a plurality of chips attached on the spacer, positioning the laminate in a chamber of an apparatus in a way that the etched wafer faces a stage of the apparatus, and introducing a solvent into the chamber to dissolve the soluble spacer so as to facilitate the chips to be supported on the stage.
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