Method of high aspect ratio plug fill

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United States of America Patent

PATENT NO 8236691
APP PUB NO 20100167532A1
SERIAL NO

12347721

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of plug fill for high aspect ratio plugs wherein a nucleation layer is formed at a bottom of a via and not on the sidewalls. The plug fill is in the direction from bottom to top of the via and not inwards from the sidewalls. The resulting plug is voidless and seamless.

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Patent Owner(s)

Patent OwnerAddress
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT633 WEST FIFTH STREET 24TH FLOOR LOS ANGELES CA 90071

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Alon, Yigal Gan Yavne, IL 1 1
Altshuler, Semeon Le Zion, IL 4 62
Horvitz, Dror Bear Tuviya, IL 7 8
Rotlain, Maor Gat, IL 5 6
Shor, Yakov Sheva, IL 5 11

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