Electronic module with vertical connector between conductor patterns
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United States of America Patent
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Aug 7, 2012
Grant Date -
Jan 26, 2012
app pub date -
Jul 23, 2010
filing date -
Jul 23, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention generally relates to a new structure to be used with electronic modules such as printed circuit boards and semiconductor package substrates. Furthermore there are presented herein methods for manufacturing the same. According to an aspect of the invention, the aspect ratio of through holes is significantly improved. Aspect ratio measures a relationship of a through hole or a micro via conductor in the direction of height divided width. According to the aspect of the invention, the aspect ratio can be increased over that of the prior art solution by a factor of ten or more.
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