Method for manufacturing a circuit board
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United States of America Patent
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Aug 14, 2012
Grant Date -
Aug 21, 2008
app pub date -
Jun 15, 2006
filing date -
Jun 16, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (13) is made, and contact openings are made in it for a component's (16) electrical contacts. After this, the component (16) is attached relative to the conductor pattern (13), in such a way that the contact areas or contact bumps of the component lie next to the contact openings. After this, an electrically conductive material is introduced to the contact openings, in order to form electrical contacts between the conductor pattern (13) and the component (16).
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