Methods and apparatus for modifying gel adhesion strength

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United States of America Patent

PATENT NO 8241458
APP PUB NO 20090114344A1
SERIAL NO

11666567

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Abstract

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The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.

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Patent Owner(s)

  • NEW YORK UNIVERSITY;POLYTECHNIC UNIVERSITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barinov, Victor Brooklyn, US 8 90
Dabrowski, Robert Brooklyn, US 3 15
Levon, Kalle Brooklyn, US 36 773

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