Conductive emissions protection
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United States of America Patent
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Aug 14, 2012
Grant Date -
Mar 18, 2010
app pub date -
Sep 18, 2008
filing date -
Sep 18, 2008
priority date (Note) -
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Abstract
According to one non-limiting embodiment, a low conductive emission substrate includes a plurality of thin high dielectric strength insulating layers separated by a corresponding plurality of conductive layers, wherein one of the plurality of conductive layers is shorted to another one of the plurality of conductive layers.
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