Electronic device and pressure sensor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 14, 2012
Grant Date -
Nov 20, 2008
app pub date -
Jul 22, 2008
filing date -
May 30, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.
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