Method of utilizing a solder reflow channel in the formation of a hard disk drive
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United States of America Patent
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Aug 14, 2012
Grant Date -
Mar 18, 2010
app pub date -
Sep 18, 2008
filing date -
Sep 18, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A method of utilizing a solder reflow channel in the formation of a hard disk drive is disclosed. The method provides a first hard disk drive component having at least one solder reflow channel, the at least one solder reflow channel for retaining a predeposited solder material. The solder reflow channel is utilized to provide a solder location for coupling the first hard disk drive component and a second hard disk drive component to the predeposited solder material.
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