Method of molding a microneedle

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United States of America Patent

PATENT NO 8246893
APP PUB NO 20110163479A1
SERIAL NO

13049448

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Abstract

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A method of molding a microneedle using a mold apparatus that includes the use of high frequency acoustic energy, such as ultrasonic energy.

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Patent Owner(s)

Patent OwnerAddress
KINDEVA DRUG DELIVERY L P11200 HUDSON ROAD WOODBURY MN 55129

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ferguson, Dennis E Mahtomedi, US 26 480
Nayar, Satinder K Woodbury, US 50 598
Pochardt, Donald L Hastings, US 27 497

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