Methods for printing an ink on a textured wafer surface
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United States of America Patent
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Aug 21, 2012
Grant Date -
Dec 31, 2009
app pub date -
Apr 24, 2008
filing date -
Apr 24, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of printing an ink on a wafer surface configured with a set of non-rounded peaks and a set of non-rounded valleys is disclosed. The method includes exposing the wafer including at least some non-rounded peaks and at least some of the non-rounded valleys in a region to an etchant. The method further includes depositing the ink on the region, wherein a set of rounded peaks and a set of rounded valleys are formed.
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